T-7110 resin is recommended for use on inorganic materials such as metal, glass, ceramics, copper-clad laminates and wires, and has a wide range of adhesion properties. The reaction speed is moderate and the cured film is soft. Acid resistant, soluble in alkaline solution.

T-7110 resin is recommended for bonding materials such as metal, glass, ceramics, etc. Strong adhesion and soft film formation. In UV ink applications, it is widely used in electronic touch screen cutting and protection UV ink, glass etching ink, circuit board etching and other fields. Excellent acid etching resistance and good alkali solubility. In the field of UV coatings, adding T-7110 resin to metal and glass coating systems can enhance the adhesion of the paint film to the substrate and coating.

 

 

 

 

 

T-7110 is used in metal etching

 

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